International Conference on Applied Superconductivity and Electromagnetic Devices

IEEE 2015 International Conference on
Applied Superconductivity and Electromagnetic Devices
(ASEMD2015)

20-23 November 2015, Shanghai, China


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The ASEMD 2015 Program


International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD2015) will be held from 20 to 23 November 2015 in Shanghai. ASEMD2015 is sponsored by IEEE Beijing Section, with co-sponsors and principal organizers of Shanghai University, Tianjin University, and Shanghai Creative Superconductor Technologies Co. Ltd..

The 1st ASEMD conference was held in Chengdu, China, on September 25-27, 2009, the 2nd was in Sydney, on December 14-16, 2011, and the 3rd was in Beijing, China, on October 25-27, 2013. The IEEE ASEMD devotes itself to providing the researchers in the field of applied superconductivity and electromagnetic devices a platform for technical discussion, exchanging information, and progress updates.

Applied superconductivity is generally categorized into material, electrical and electronic sections. Material synthesis and characterization, power applications, rotating machines, and magnet technology are essential components comprising one principal part of the ASEMD scope.

Electromagnetic devices, the other principle part of ASEMD, covers electric, magnetic, and electronic devices, either superconducting or not. This part also includes work in electromagnetic analysis, measurement, and automation.

ASEMD2015 continues the focus and provides a forum for both academic and industrial researchers in the relevant fields to discuss and share ideas, present results, reflect on past experiences and discuss future developments.

Contributed papers to this conference will be published in its proceedings in the IEEE Xplore digital library, selected contributions will be published in a special issue of IEEE Transaction on Applied Superconductivity through the normal peer review process.

The scope of the conference includes principally the following topics:

  • A.Materials
  • 1.Practical superconductors, HTS and LTS wires/tapes, films, and bulk superconductors.
    2.Advanced materials for emerging EM technologies.
    3.Materials for superconducting devices.
  • B.Superconducting Electric Power Devices
  • 1.Transmission and distribution cables, links, SC loops
    2.Transformers and reactors
    3.Fault current limiters
    4.Energy storage, SMES
    5.Current leads
  • C.Electrical Power Systems
  • 1. Grid studies with superconducting equipment
    2.Active distribution network and micro-grid
    3.Power system analysis, protection and control
    4.High voltage transmission technology
  • D.Electrical Machines
  • 1.Superconducting machines
    2.Permanent magnet machines
    3.AC machines and their applications
    4.Electrical machine design and modeling
    5.Special machines and electromechanical devices.
  • E.Magnets
  • 1.Superconducting magnet systems
    2.Permanent magnets
    3.Electromagnets
    4.Magnet applications
  • F.Superconducting Electronics
  • 1.Microwave and THz devices & systems
    2.Junction and circuit design and fabrication
    3.SQUIDs and related detectors
    4.Other passive & active electronic devices
    5.Applications of superconducting electronics
  • G.Cryogenics and Thermal/Electrical Insulation
  • 1.Cryocoolers
    2.Cooling systems for LTS/HTS applications
    3.Thermal insulation for LTS/HTS devices
    4.Electrical insulation for LTS/HTS devices
  • H.Modeling, Analysis and Design
  • 1.Modeling of material properties, such as magnetization, pinning, polarization and losses
    2.Modeling of the superconducting stability and quench protection
    3.Numerical Analysis for superconducting and electromagnetic devices
    4.Multi-physical computation for superconducting and electromagnetic devices
    5.Optimization for superconducting and electromagnetic devices

    Prospective authors are invited to submit papers online electronically on this website http://www.asemd.org or emailed to asemd@sina.com

    A template for the manuscript submission with submission details will be sent to you for your preparation, and it will also be available at this conference website.

    Authors are required to register and present their papers at the conference. Please refer to the conference web site "For Authors" for the methods to register.

    Contacts: asemd@sina.com, or www.asemd.org


    Sponsor - IEEE Beijing